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Rockchip RK3588

Product Overview​

The RK3588 is Rockchip's flagship AIoT application processor SoC, built on an advanced 8nm process, integrating an octa-core CPU of quad-core Cortex-A76 + quad-core Cortex-A55, a Mali-G610 MC4 GPU, and a 6 TOPS tri-core in-house NPU. Released in late 2021 and in mass production in 2022, its "CPU+GPU+NPU+VPU" four-in-one architecture has made it the mainstay chip for edge boxes, development boards (Orange Pi, Firefly, etc.), and industrial HMIs.

The RK3588 supports 8K@60fps video decoding, 8K@30fps encoding, and a 32MP ISP (HDR/3DNR). The NPU supports INT4/INT8/INT16/FP16/BF16/TF32 mixed precision and can run YOLO, segmentation, OCR, and lightweight large models. It is positioned as an "all-round main controller" and is often combined with dedicated AI accelerator chips (such as the BM1684X) in heterogeneous solutions.

Core Specifications​

ParameterValue
ArchitectureOcta-core 64-bit (4×Cortex-A76 + 4×Cortex-A55) + Mali-G610 MC4 + tri-core in-house NPU
Process Node8nm
FP16 / BF16 ComputeSupports FP16/BF16 (NPU mixed precision; specific TFLOPS not broken out, estimated at about the 3 TFLOPS level)
INT8 Compute6 TOPS
FP32 ComputeNot disclosed (GPU counted separately, not an NPU metric)
Memory CapacityUp to 32GB (LPDDR4 / LPDDR4X / LPDDR5)
Memory TypeLPDDR4 / LPDDR4X / LPDDR5
Memory BandwidthNot disclosed
TDPAbout 5–8 W (system level, depending on configuration)
InterconnectPCIe 3.0/2.0, SATA3.0, USB3.1 Type-C, Gigabit Ethernet, eDP/DP/HDMI2.1/MIPI
InterfaceSoC on-board (development board / edge box)
LaunchLate 2021 (release) / 2022 (mass production)
Mass Production/AvailabilityMass production in 2022

Key Features​

  • 6 TOPS tri-core NPU: supports INT4/INT8/INT16/FP16/BF16/TF32 mixed precision.
  • 8K multimedia: 8K@60fps decoding, 8K@30fps encoding, multi-screen heterogeneous display.
  • 32MP ISP: HDR, 3DNR, multi-camera input (MIPI CSI-2 + DVP + HDMI RX).
  • Rich high-speed interfaces: PCIe, Type-C, SATA, Gigabit Ethernet, easy to expand.
  • Dual OS: Android and Linux, mature ecosystem with many development boards.
  • High energy efficiency: 8nm process, better edge-scenario energy efficiency than traditional x86 solutions.

Vendor Information​

ParameterValue
CompanyRockchip Electronics Co., Ltd. (Rockchip)
HeadquartersFuzhou, China
Founded2001

Use Cases​

  • ✅ Edge AI boxes, 8K multimedia terminals, industrial HMIs, smart cockpits, ARM PCs, multi-screen display
  • ❌ Data center training, ultra-high-density (>16-channel) video analytics (weaker than the dedicated AI chip BM1684X)

References​