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Innosilicon Fenghua 2

Product Overview​

Fenghua 2 (Fenghua No.2) is Innosilicon's second-generation self-developed GPU, released in Wuhan on 2022-08-03. Unlike the 2021 Fenghua 1, which targeted high-performance data centers, Fenghua 2's core goals shifted to versatility and ultra-low power: the chip adopts a full set of Innosilicon's own IPs, with FP32 floating-point compute of 1.5 TFLOPS, texture/pixel fill rate of 48 GTex/s (48 GPixel/s), and AI compute of 12.5 TOPS (INT8), while typical operating power is only 4~15W, as low as about 4W at minimum. It can be designed as a passively cooled (fanless) structure and can also be used in laptops and MXM all-in-ones.

Fenghua 2 is a 4K-class high-performance rendering GPU that integrates ultra-low power, HD triple-display output, and intelligent AI edge computing, with built-in AI and floating-point compute cores supporting scientific and edge computing. The chip supports Innosilicon's own LPDDR5X memory technology (also compatible with LPDDR5/4X/4), can drive 4K@60Hz triple independent displays, and integrates physical unclonable function (PUF) security technology and hardware virtualization.

On the domestic ecosystem front, Fenghua 2 has completed mutual certification with domestic operating systems such as UOS, Kylin (Galaxy Kylin, NeoKylin), and supports domestic CPU platforms including Phytium, Loongson, Sunway, Hygon, Zhaoxin, and Kunpeng, while remaining compatible with mainstream Intel / AMD x86 CPUs and systems such as Windows and Ubuntu. It scored over 6500 in the GLmark2 benchmark on Kylin OS and passed the heavy Unigine Heaven benchmark. Launch demonstrations covered scenarios such as Kingsoft WPS, ZWCAD, GIS, glmark, a racing game, and Windows 10 office and entertainment use.

Commercial traction: on launch day, Innosilicon signed procurement agreements worth a total of RMB 500 million with companies including China Energy Engineering Investment and UnionTech (UOS), covering "Eastern Data, Western Computing" project orders and Xinchuang industry demand; in September 2023 it formed a strategic partnership with SAHC to advance Fenghua 2 in industrial applications. Fenghua 2 won the "2022 Hardcore China Chip — Best Processor Chip" award.

⚠️ Positioning Clarification Some sources classify Fenghua 2 as a "server/data center-class GPU". According to Innosilicon's official announcements and multiple media reports, Fenghua 2's primary positioning is an ultra-low-power desktop / laptop / industrial PC / embedded GPU (typical power 4~15W, PCIe 3.0 x8, LPDDR5X memory up to 8GB). The official materials also mention it can "provide 4K-class rendering support to aid data center computing", but the server/data center-class high-performance positioning belongs to Fenghua 1 (5 TFLOPS FP32, GDDR6X, up to 16GB, 304 GB/s), not Fenghua 2. This page follows the official low-power desktop positioning.

Core Specifications​

ParameterValue
ArchitectureInnosilicon proprietary GPU architecture (full set of self-developed IPs, self-developed controllable core evolution)
Process NodeNot disclosed
FP16 / BF16 ComputeNot disclosed
INT8 Compute12.5 TOPS
FP32 Compute1.5 TFLOPS
Texture/Pixel Fill Rate48 GTex/s / 48 GPixel/s
Memory Capacity2GB / 4GB / 8GB
Memory TypeLPDDR5X / LPDDR5 / LPDDR4X / LPDDR4 (Innosilicon's own LPDDR5X technology), GDDR6 option also available
Memory BandwidthNot disclosed
TDPTypical power 4~15 W (measured; supports high-performance and low-power modes; passive cooling possible)
InterconnectNot disclosed (no multi-card interconnect solution)
InterfacePCIe 3.0 x8
Display OutputsHDMI 2.0 ×2, DP 1.4 ×1, VGA ×1, LVDS ×1; supports 4K@60Hz triple independent displays
Graphics APIsOpenGL 4.2, OpenGL ES 3.2, Vulkan 1.2, DirectX 11
Compute APIsOpenCL 3.0
AI FrameworksCaffe, TensorFlow, PyTorch
Video Capability4K hardware video decoding
VirtualizationHardware virtualization, multiple operating systems running simultaneously
SecurityBuilt-in physical unclonable function (PUF) security technology
Benchmark ResultsGLmark2 > 6500 on Kylin OS; passed the heavy Unigine Heaven test
Launch2022-08-03 (Wuhan launch event)
Mass Production/AvailabilityIn mass production and commercial use; RMB 500 million in procurement agreements signed on launch day (China Energy Engineering Investment, UOS, etc.)

Key Features​

  • Industry-leading energy efficiency: runs office, gaming, CAD, and glmark smoothly at operating power as low as about 4W, with energy efficiency far better than products of similar compute; fanless designs, laptops, and MXM all-in-ones supported under appropriate conditions
  • 4K triple independent display output: HDMI 2.0×2 + DP 1.4 + VGA + LVDS, meeting industrial and multi-screen office needs
  • Self-developed LPDDR5X memory technology: low-power high-bandwidth memory IP, extending Innosilicon's core advantage in memory interface IP
  • Fully domestic board BOM: memory, power management, and other components on the board are all domestically sourced; cross-process, cross-package design ensures supply chain security
  • Among the broadest Xinchuang ecosystem support: mutually certified with UOS and Kylin; supports six domestic CPU platforms — Phytium, Loongson, Sunway, Hygon, Zhaoxin, and Kunpeng
  • Built-in AI + floating-point compute cores: 12.5 TOPS (INT8) AI compute, supporting scientific computing and edge AI inference
  • Hardware virtualization: multiple operating systems running simultaneously
  • PUF hardware security: physical unclonable function technology, anti-cloning and anti-tampering
  • Well-validated commercially: RMB 500 million in orders on launch day, covering "Eastern Data, Western Computing" and Xinchuang projects
  • Limitations: 1.5 TFLOPS FP32 is entry-level; PCIe 3.0 x8 interface bandwidth is limited; max 8GB memory; memory bandwidth not disclosed; no large-model training/inference capability

Vendor Information​

ParameterValue
CompanyInnosilicon
HeadquartersWuhan, Hubei Province (East Lake High-Tech Development Zone); R&D centers in Zhuhai, Suzhou, Xi'an, Beijing, Shanghai, Shenzhen, Dalian, and Chengdu
Founded2006 (founder Ao Hai)
R&D ScaleR&D team of over one thousand; thousands of core IPs; 200+ global core patents
Mass Production AccumulationOver 300 advanced-process tape-outs; supported mass production of over 10 billion high-end SoC chips
Process Coverage55nm — 3nm, covering TSMC / Samsung / SMIC / GlobalFoundries / UMC / Intel / Huali
Fenghua 2 Development LeadLed by Innosilicon VP Mao Mingming; algorithm team led by chief algorithm scientist Dr. Yang Xile (former Imagination architect)
Business StatusProfitable for consecutive years, not reliant on external financing; preparing for a STAR Market IPO
Fenghua Series EvolutionFenghua 1 (2021-11, data center class) → Fenghua 2 (2022-08, low-power desktop class) → Fenghua 3 (2025-09, full-function GPU integrating a RISC-V CPU with a CUDA-compatible GPU)
Official Websitehttps://www.innosilicon.com.cn

Use Cases​

  • ✅ Xinchuang office desktop graphics (supports WPS, ZWCAD, and other domestic office and engineering software)
  • ✅ Industrial equipment (financial terminals, rail transit terminals, and other industrial environments)
  • ✅ Embedded display and compute (smart terminals, in-vehicle systems)
  • ✅ Fanless / passively cooled low-power systems, laptops, MXM all-in-ones
  • ✅ Edge AI inference (12.5 TOPS INT8)
  • ✅ 4K triple-display multi-monitor office and surveillance walls
  • ✅ Desktop virtualization (hardware virtualization with multiple parallel systems)
  • ❌ Large-model AI training (1.5 TFLOPS FP32, no HBM, no interconnect)
  • ❌ Large-model inference (max 8GB memory)
  • ❌ High-density data center cloud rendering (choose Fenghua 1 instead)
  • ❌ High-end AAA gaming and professional real-time rendering
  • ❌ Direct migration from the CUDA ecosystem

References​